MCoil VS
The MCoil VS is our I-core coil with a Feron core and resin-soaked round wire – compact, PCB-compatible, and mechanically optimized for maximum stability. Feron ensures very low magnetization losses at low signal levels and very late saturation under load. The large air gap – or open magnetic circuit – ensures exceptional power handling capacity in this design. The result: greater stability, clear contour, and clean dynamics – even in parallel and correction circuits.
Product Finder
Use our product finder to filter for components based on key specifications. This ensures you get the best results tailored to your individual requirements.
VS100
Feron-I core coil with resin-soaked round wire (Ø 1.00 mm) – compact, PCB-compatible, and mechanically optimized for stability; a large air gap ensures exceptional power handling capacity in this design.
Baked Varnish Wire/ Resin Soaking
Baked varnish wire is enamel-insulated wire with an additional, activatable hot-melt outer layer, which has an adhesive effect when heated. The windings are thus fixed together.
Impact in practice
- The coil becomes mechanically stable and „works“ significantly less
- Micro-movements between windings are reduced
- In particular, this reduces macro-microphonic effects (the windings „work“ less) and increases “silence” during operation
Resin soaking as an alternative to baked varnish wire
If no baked lacquer wire is used, resin soaking carried out under vacuum can take over the mechanical fixing. The resin penetrates into the wrap, reduces cavities and degrees of freedom of movement and transforms the wrap into a stable compound. The result: significantly less macro microphones and an overall quieter, more precise operation of the coil.
OFC Copper
- Purity: at least 99.995% Cu, often 99.999% (4N) or higher
- Feature: almost oxygen-free (typically <10 ppm)
- Result: more stable grain boundaries, less oxide formation, more uniform electron flow
Feron I-Core
The Feron I-Core coil uses a rod core made of grain-oriented Feron sheet metal and incorporates the material advantages of Feron in a particularly compact design. It integrates seamlessly and is frequently used on printed circuit boards.
Due to its open-core design, it remains exceptionally robust for its size and operates very cleanly at both low and high signal levels. The RDC is higher than the E-Core or Zero Ohm, but the design is significantly more economical and space-saving.
A clean layout remains important, as the magnetic stray field must be considered for PCB mounting.
3
Products
VS125
Feron-I core coil with resin-soaked round wire (Ø 1.25 mm) – compact, PCB-mountable, and designed for maximum stability, contour, and fine dynamics; large air gap for very high power handling.
Baked Varnish Wire/ Resin Soaking
Baked varnish wire is enamel-insulated wire with an additional, activatable hot-melt outer layer, which has an adhesive effect when heated. The windings are thus fixed together.
Impact in practice
- The coil becomes mechanically stable and „works“ significantly less
- Micro-movements between windings are reduced
- In particular, this reduces macro-microphonic effects (the windings „work“ less) and increases “silence” during operation
Resin soaking as an alternative to baked varnish wire
If no baked lacquer wire is used, resin soaking carried out under vacuum can take over the mechanical fixing. The resin penetrates into the wrap, reduces cavities and degrees of freedom of movement and transforms the wrap into a stable compound. The result: significantly less macro microphones and an overall quieter, more precise operation of the coil.
OFC Copper
- Purity: at least 99.995% Cu, often 99.999% (4N) or higher
- Feature: almost oxygen-free (typically <10 ppm)
- Result: more stable grain boundaries, less oxide formation, more uniform electron flow
Feron I-Core
The Feron I-Core coil uses a rod core made of grain-oriented Feron sheet metal and incorporates the material advantages of Feron in a particularly compact design. It integrates seamlessly and is frequently used on printed circuit boards.
Due to its open-core design, it remains exceptionally robust for its size and operates very cleanly at both low and high signal levels. The RDC is higher than the E-Core or Zero Ohm, but the design is significantly more economical and space-saving.
A clean layout remains important, as the magnetic stray field must be considered for PCB mounting.
15
Products
VS140
Feron-I core coil with resin-soaked round wire winding (Ø 1.40 mm) – compact, PCB-compatible, and capable of handling particularly high currents with very low Macro-Microphony; wide air gap for high power handling.
Baked Varnish Wire/ Resin Soaking
Baked varnish wire is enamel-insulated wire with an additional, activatable hot-melt outer layer, which has an adhesive effect when heated. The windings are thus fixed together.
Impact in practice
- The coil becomes mechanically stable and „works“ significantly less
- Micro-movements between windings are reduced
- In particular, this reduces macro-microphonic effects (the windings „work“ less) and increases “silence” during operation
Resin soaking as an alternative to baked varnish wire
If no baked lacquer wire is used, resin soaking carried out under vacuum can take over the mechanical fixing. The resin penetrates into the wrap, reduces cavities and degrees of freedom of movement and transforms the wrap into a stable compound. The result: significantly less macro microphones and an overall quieter, more precise operation of the coil.
OFC Copper
- Purity: at least 99.995% Cu, often 99.999% (4N) or higher
- Feature: almost oxygen-free (typically <10 ppm)
- Result: more stable grain boundaries, less oxide formation, more uniform electron flow
Feron I-Core
The Feron I-Core coil uses a rod core made of grain-oriented Feron sheet metal and incorporates the material advantages of Feron in a particularly compact design. It integrates seamlessly and is frequently used on printed circuit boards.
Due to its open-core design, it remains exceptionally robust for its size and operates very cleanly at both low and high signal levels. The RDC is higher than the E-Core or Zero Ohm, but the design is significantly more economical and space-saving.
A clean layout remains important, as the magnetic stray field must be considered for PCB mounting.
23
Products
VS180
Feron-I core coil with resin-soaked round wire winding (Ø 1.80 mm) – maximum current-carrying capacity in a compact I-core design, mechanically “quiet” due to resin soaking; large air gap for exceptional power handling.
Baked Varnish Wire/ Resin Soaking
Baked varnish wire is enamel-insulated wire with an additional, activatable hot-melt outer layer, which has an adhesive effect when heated. The windings are thus fixed together.
Impact in practice
- The coil becomes mechanically stable and „works“ significantly less
- Micro-movements between windings are reduced
- In particular, this reduces macro-microphonic effects (the windings „work“ less) and increases “silence” during operation
Resin soaking as an alternative to baked varnish wire
If no baked lacquer wire is used, resin soaking carried out under vacuum can take over the mechanical fixing. The resin penetrates into the wrap, reduces cavities and degrees of freedom of movement and transforms the wrap into a stable compound. The result: significantly less macro microphones and an overall quieter, more precise operation of the coil.
OFC Copper
- Purity: at least 99.995% Cu, often 99.999% (4N) or higher
- Feature: almost oxygen-free (typically <10 ppm)
- Result: more stable grain boundaries, less oxide formation, more uniform electron flow
Feron I-Core
The Feron I-Core coil uses a rod core made of grain-oriented Feron sheet metal and incorporates the material advantages of Feron in a particularly compact design. It integrates seamlessly and is frequently used on printed circuit boards.
Due to its open-core design, it remains exceptionally robust for its size and operates very cleanly at both low and high signal levels. The RDC is higher than the E-Core or Zero Ohm, but the design is significantly more economical and space-saving.
A clean layout remains important, as the magnetic stray field must be considered for PCB mounting.
20
Products