Baked Varnish Wire/ Resin Soaking

Baked varnish wire is enamel-insulated wire with an additional, activatable hot-melt outer layer, which has an adhesive effect when heated. The windings are thus fixed together.

Impact in practice

• The coil becomes mechanically stable and „works“ significantly less
• Micro-movements between windings are reduced
• In particular, this reduces macro-microphonic effects (the windings „work“ less) and increases “silence” during operation

Resin soaking as an alternative to baked varnish wire

If no baked lacquer wire is used, resin soaking carried out under vacuum can take over the mechanical fixing. The resin penetrates into the wrap, reduces cavities and degrees of freedom of movement and transforms the wrap into a stable compound. The result: significantly less macro microphones and an overall quieter, more precise operation of the coil.

OFC Copper

• Purity: at least 99.995% Cu, often 99.999% (4N) or higher
• Feature: almost oxygen-free (typically <10 ppm)
• Result: more stable grain boundaries, less oxide formation, more uniform electron flow

Feron I-Core

The Feron I-Core coil uses a rod core made of grain-oriented Feron sheet metal and incorporates the material advantages of Feron in a particularly compact design. It integrates seamlessly and is frequently used on printed circuit boards.

Due to its open-core design, it remains exceptionally robust for its size and operates very cleanly at both low and high signal levels. The R_DC is higher than the E-Core or Zero Ohm, but the design is significantly more economical and space-saving.

A clean layout remains important, as the magnetic stray field must be considered for PCB mounting.