Mundorf MSolder SUPREME SilverGold Ø1.0mm x L1.9m Sn88.6Cu1.8Ag9.5Au0.1 solder

MSOL.SUP-010G

The alloy, with increased copper and silver/gold content, combines a high melting temperature with unmatched conductivity.

Technologies

Silver-Gold Metallization (Ag-Au)

Gold stabilizes interfaces, smooths out microspectrum, adds color to silver.

Silver

Microdetails, decay processes and room information are exceptionally clearly and cleanly perceivable.

Technical data

Article number
MSOL.SUP-010G
Weight
0.010 kg
Solder dimensions
Ø1.0mm x L1.9m
Dimensions
Ø50xH2 mm
Liquidus
290°C/554°F
Flux
3.5% No-Clean 2.2.3 B
Downloads
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